scientific result | nanotechnology
The acoustic waves emitted by the propagation of a crack can modify the trajectory of the crack and the trace it leaves in the material. This is how we explain the morphology of silicon wafers after cleavage. This discovery would allow to improve the industrial process of manufacturing silicon-on-insulator wafers (Smart CutTM technology) and more widely, to better control the fracture of materials.
Thesis presented December 11, 2015 by Damien Massy. PhD thesis available as a pdf file.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.